Comprehensive Testing
Component Testing & Inspection Protocols
Structured inspection workflows covering visual, X-ray, electrical, and destructive analysis for high-risk electronic components.
How We Use It
Rigorous Multi-Layer Inspection
Every component undergoes a systematic inspection process designed to identify counterfeit, damaged, or out-of-specification parts before they reach your supply chain.
Our testing protocols scale from basic visual inspection to advanced destructive analysis, tailored to component type and risk profile.
At-A-Glance Coverage
Protocol Matrix
| Component | Visual | Electrical | X-Ray | Cross-Section | Decap | Spec / Func |
|---|---|---|---|---|---|---|
| Resistors / Inductors | — | — | — | |||
| Capacitors | — | — | ||||
| Diodes / LEDs | — | — | ||||
| Crystals / TCXO | — | — | — | |||
| Transistors / MOSFETs | — | — | — | |||
| Integrated Circuits | — |
Representative coverage only. The exact path depends on device family, package, and risk profile.
Core Inspection Layers
How We Escalate
01
Visual Inspection
High-resolution imaging and microscopy to detect physical defects, markings, and packaging anomalies.
02
X-Ray Analysis
Internal structure verification to identify solder joint quality, die integrity, and internal defects.
03
Electrical Testing
Functional and parametric testing to verify performance against manufacturer specifications.
04
Destructive Analysis
Cross-sectioning and decapsulation for high-risk components to verify die authenticity and quality.
Protocols
Testing Coverage By Component Type
Resistors & Inductors
- 1Visual inspection for markings and packaging
- 2Electrical measurement of resistance/inductance
- 3X-ray verification of internal structure
Capacitors
- 1Visual inspection and marking verification
- 2Capacitance and ESR measurement
- 3X-ray and cross-section analysis for high-risk lots
Diodes & LEDs
- 1Visual inspection and color verification
- 2Forward voltage and leakage current testing
- 3Decapsulation and die analysis for authenticity
Crystals & TCXO
- 1Frequency and load capacitance measurement
- 2Aging and temperature stability testing
- 3Decapsulation for internal verification
Transistors & MOSFETs
- 1Visual inspection and marking check
- 2Parametric testing (Vce, Vgs, gain)
- 3Decapsulation and die verification
Integrated Circuits
- 1Visual inspection and package verification
- 2Functional and parametric testing
- 3X-ray, cross-section, and decapsulation analysis
Ready to Secure Your Supply Chain?
Submit an RFQ or contact our team to discuss your component testing and authentication requirements.